Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding

摘要：

Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology (SoP) of the fine pitch flip chip bonding. With this material, the solder bump array was successfully formed with pitch of 150 μm in one direction.

作者: Kwang-Seong Choi Sun-Woo Choo Jong-Jin Lee Ki-Jun Sung Hyun-Chel Bae Byeong-Ok Lim Jong-Tae Moon Yong-Sung Eom

作者单位: Electronics and Telecommunications Research Institute 138 Gajeongno, Yuseong-gu, Daejeon, 305-700, Korea

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 805-809

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）