Modeling and Characterization of the Bonding-Wire Interconnection for Microwave MCM

摘要：

The 3-D electromagnetic software Ansoft HFSS is adapted to modeling analysis and simulation optimization about the microwave characteristics of bonding interconnection in the MMCM. The gold bond model contained micro strip is set up to emulate and optimize for insertion loss (IL) and return loss (RL), according to the major parameters such as arch highness, span and the root of the number of gold. Micro strip model of three roots copper wire connection is established to analyses the difference between microwave characteristics of the golden and copper. The results showed that arch highness of bonding gold wire is the lower the better in the case of singles gold and the same span. The span of bonding gold wire is the shorter the better in the case of singles gold and the same arch highness. It should be as far as possible bond 2 or 3 roots gold if the chip welding area allowed. Copper wire has shown better microwave properties than gold in the area of return loss and insertion loss.

作者: Liang Ying Huang ChunYue Wang Wangang

作者单位: Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 6 School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, College of Information Engineering, Chongqing City Management College, Chongqing 401331, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 810-814

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）