Finite element analysis of the transducer vibration in die bonding operations
With the every decreasing pitch spacing of required in the microelectronic packaging industry, higher bond quality is required. In order to further understand the mechanics of the bonding operations, the vibration of the transducer is being studied to identify how bonding quality can be improved. In this paper a computational efficient method of analysing the vibration of the transducer is described, using a combination of a steady analysis and a dynamic analysis to model non linear effects of contact and resistant to motion. The initial results show that the method works, however unknown quantities such as the magnitude of the resistive force have yet to be determined in the laboratory. This model will be useful tool in designing the experiments to determine these unknowns.
Die bonding Ultrasonic Transducer vibration Dynamic simulation
Robert Kelly Jian Gao Zhi Jun Yang Xin Chen
Guangdong University of Technology, 100 Waihuan Xi Road, Guangzhou 510006, P.R. China
国际会议
西安
英文
884-888
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）