Dynamic Current Characteristic of Ultrasonic Transducer for Wire Bonding

摘要：

Ultrasonic transducer, as an important part of thermosonic wire bonding system, converts the electrical energy into mechanical vibration energy, results in an oscillatory motion parallel to the bonding interface. This paper studies the dynamic current characteristic of the ultrasonic transducer during thermosonic wire bonding process. The equivalent circuit model of ultrasonic transducer is set up based on Butterworth-Van Dyke (BVD) model. The input impedance and dynamic current characteristic are calculated by MATLAB. The electrical parameters are measured by an impedance analyzer, and the dynamic current characteristic was measured with a new ultrasonic generator developed based on FPGA. The simulation result agrees well with the experiment result. It is shown that keeping stimulation frequency offset to the resonance frequency of transducer can reduce transient state process and improve the bonding speed.

关键词： Dynamic current Characteristic Ultrasonic transducer Thermosonic wire bonding Ultrasonic generator

作者: Changhui ZOU Fuliang WANG Jiaping QIAO

作者单位: Central South University College of Mechanical and Electrical Engineering, Central South University,Changsha, 410083, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 897-901

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）