CAD/CAM software framework design for the laser micromachining device driven by two stages

摘要：

Laser processing has emerged in the last few years as the most widely accepted method of creating micro-vias in highdensity electronic interconnect and chip packaging devices. This paper reports one kind of UV laser machine tool which has been applied to LTCC mass production lines and suitable for drilling micro-vias and cutting cavities for green tape with high productivity and high accuracy. It puts emphasis on the CAD/CAM software framework design for the described UV laser machine, which can overcome the challenges that the socalled compound laser beam positioning system driven by two stages brings to the software design. Some data processing techniques including scan field dividing, tool path generation, and scanner post processing, are presented.

作者: Fanhui Meng Hongzhi Wang

作者单位: the 45th Research Institute of CETC Yanjiao East, Beijing 101601, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 902-905

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）