Reliability of indium solder die bonding of high power cm-bars

摘要：

High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high power laser die bonding, its’ reliability is rated as the key parameter deciding about the more or less extensive use of indiun solder die bonding of high power diode arrays. In this paper, 20 samples were tested under two conditions, three degradation modes were observed during the lifetime test, the failure analysis results showed that the stress and defects induced during the indium solder bonding process play a key role in the degradation behavior of the bars.

作者: Lu Guoguang Huang Yun En Yunfei

作者单位: CEPREI, National Key Laboratory of Science and Technology on Reliability Physics No.110 Dongguanzhuang Rd., Tianhe District, Guangzhou, China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 968-972

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）