Application of FEM Simulation Technology on Thermal Design of Electronic Packaging Device
Thermal design is necessarily to be considered for highpower electronic packaging device design. In this paper, the thermal characteristic of packaging device was studied using FEM, for example, phase shifter and LED. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simution shows tendency as tested experiment results, verifing the correctness of the simulation model and method used. The relation of relative temperature rising to different solder voids, substrate thickness and material is studied by simution. The quantitative ralations of these parameters and temperature provided a theoretical basis for the thermal design, the optimization of parameters and the reliability improvement of phase shifter and LED.
Song Fang fang Lai Ping Feng Xian-long He Xiao-qi
National Key Laboratory of Science and Technology on Reliability Physics and Application of Electron National Key Laboratory of Science and Technology on Reliability Physics and Application of Electron
国际会议
西安
英文
977-979
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）