Effect of Ni Barrier on the Tin Whisker Formation of Electroplating Sn on Lead-frame Alloy

摘要：

Electroplating matte Sn has attracted much attention in the lead-free age. To prevent a growth of tin whiskers from lead-frame supported matte tin films, various mitigation methods have been reported. In this work, pure matte Sn was electroplated onto C194 alloy, and electroplating Ni film was used as a barrier between matte Sn and lead-frame alloy. The microstructures of the Ni/Sn depositions and tin whisker growth were investigated through using scanning electron microscope (SEM). It was found that the Ni barrier layer played an important role in suppressing the growth of tin whiskers.

作者: Yiqing Wang Jiangyan Sun Ming Li Dali Mao Dongyan Ding Ting Liu Klaus-Peter Galuschki Yu Hu Angela Gong Ming Shen Hongqi Sun Xianfeng Wang

作者单位: Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, Scho Shanghai Sinyang Semiconductor Materials Co.,Ltd.,Shanghai 201616, China SMT Technology & Material, Corporate Technology,Siemens Ltd., China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 980-983

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）