The Effects of Response Features on Failure Modes of Board Level Drop Impact Test
Small portable electronic products are getting popular during last decade. For this type of mobile devices, one of the most common failure events is related to the accidental drop impact during daily usage. In this paper, the responses of PCB were collected during drop impact; the loading features are analyzed with response data; failure analyses were conducted to determine the failure modes of the test. The failure modes and mechanism were discussed with the response data and actual failure data. Results shows that impact loading response performed as several damping rebound, which results to a combination damage of impact and fatigue. Eigenfrequency dominate the deformation in length direction, while some higher modes dominate the deformation in Y direction. Higher frequency at lower strain level may also produce great damage, considering strain rate effects. Failure modes of drop impact tests are complicated. Five failure modes are observed with failed assembly samples, including complete cracks in the bulk and intermetallic layers; failure sites transition between bulk and intermetallic layers, and cracks in the RCC. Failure mechanism also shows an obvious combining of impact and fatigue.
Y. Liu F.L. Sun F.J.H.D. Kessels W.D. van Driel G.Q.Zhang
School of Material Science and Engineering, Harbin University of Science and Technology, 150040 Harb NXP Semiconductors, Gerstweg 2, 6534 AE Nijmegen, The Netherlands; Philips LightLabs, Mathildelaan 1,5611 BD Eindhoven, The Netherlands;Delft University of Technology,
国际会议
西安
英文
984-988
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）