Determining parameter of solder joint defect characterization based on correlation analysis
The relationship between surface mount component solder joint section area and solder defect, section height and solder defect, contact angle and solder defect were studied respectively. By using dividing method, the contour data of solder joint center section was obtained and the shape parameters of solder center section were calculated. By using the least-square method, regression analysis was carried out, the correlation coefficient between the input vectors and solder defects was calculated, which can be used to discriminate the correlation between the selected input vectors and the solder defects. The results show that: the section area, section height and contact angle have related with solder quantity, contact angle also has relationship with solder joint wet ability.
Huang ChunYue Wang Wangang Liang Ying Li Tianming
School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, College of Information Engineering, Chongqing City Management College, Chongqing 401331, China Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 6 Department of Automobile and Power Engineering,Guilin College of Aerospace Technology, Guilin 541004
国际会议
西安
英文
1003-1006
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）