Pad Finish Related Board-level Solder Joint Reliability Research
Pad finish is the direct interface between PCB and solder ball, it plays an important role in determining the compound and characteristics of IMC formed at those interfaces, and even to change the mechanical property and microstructure of bulk solder joint. In this paper, we investigated the reliability property of 10 different pad finish combinations. The substrate finish includes electro-plated NiAu, ENEPIG with different Gold and Palladium thickness, and OSP. Board side finishes are ENIG and OSP. We have set up the database of life data for all groups under different reliability test conditions and found out the pad finish related failure mechanism.
Chen Zhengrong Zhou Jianwei Fu Xingming Lee Jaisung
Samsung Semiconductor China R&D CO., LTD Jinjihu Road 15＃, Suzhou Industrial Park Jiangsu Province, China, 215021
国际会议
西安
英文
1039-1042
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）