The Reliability Evaluation of Cu Wire Bonding by Using Focus Ion Beam System

摘要：

The cross sections of bonding have been made by using focus ion beam(FIB) system on the advanced chips packaged with BGA. Through the measurement of aluminum layer thickness under different bond force, the bonding reliability has been evaluated. The comparison has also been made on the interface of Au wire Bonding and Cu wire Bonding. Since the Cu wire Bonding process is more difficult, When it is used in the advanced chips, the bonding reliability should be evaluated.

作者: Zhang XiaoWen Lin XiaoLing Chen Yuan

作者单位: National Key Laboratory of Science and Techonlogy on Reliability Physics and Application of Electronic Component 110 Dong Guang Zhuang Road , Tianhe District, Guangzhou, P.R.China.

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1049-1052

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）