Elasto-plastic Analysis of Popcorn Failure Caused by Cavitition Unstable Growth in Plastic IC Packaging Material

摘要：

Popcorn failure in Hyperelastic-plastic electronic packages under thermal load and Moisture is studied. Using the theory of finite deformation, we obtain the analytical relation between void growth and the sum of the vapor pressure induced by moisture and thermal stress induced by heat mismatch. Numerical analyses show that the critical traction decreases with decreases of yield stress-shear modulus ratio when plastic behavior of material is considered. On the other hand the critical traction decreases with increase of the initial porosity when yield stress-shear modulus ratio is given.

关键词： Cavitition hyperelastic-plastic material popcorn failure

作者: Li Zhigang Yuan Guozheng Shu Xuefeng

作者单位: Mechanical Department, Taiyuan University of Technology, Taiyuan 030024; Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, Taiyuan 0

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1073-1076

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）