Mechanical Characterization of the IMC layer by using nano-indentation Tests
The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic Compound, which is between lead-free solder Sn3.OAg0.5Cu and Cu-pad, were measured by using nano-indentation tests, while the load-displacement curves, displacement-elastic modulus curve and displacement-hardness curves were recorded. Modulus and hardness of these IMCs were characterized by Nanoindentation CSM from plan view in this study. Basing on these experimental data, The calculation of modulus and hardness for IMC layers was based on nano-indentation CSM test results and was compared with reported results.
IMC nano-indentaion SAC solder
Yuan Guozheng Li Zhigang Shu Xuefeng
Institute of Applied Mechanics & biomedical engineering, Taiyuan University of Technology,Taiyuan, Shanxi 030024, China,
国际会议
西安
英文
1077-1079
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）