会议专题

Methodology of Testability Design of Electronic Components Based On the Boundary-Scan Method

The complex electronic components should be tested during either the period of design and manufacture or the period of debugging and running to ensure that their application quality meet the requirements. However, the traditional testing technology encounters tremendous difficulties and the cost of testing is expensive with the rapidly development of the electronic components’ integrated technology and the increase of the complexity of their own. Academic research and testing practice indicate that the problem of testing for the electronic components can be predigested and eventually solved no other than improving the testability design of the electronic components. In this paper, at first, the basic principle and the testing flow of the boundary-scan method are introduced. Then, fault models of the electronic components and mathematical model for the boundary-scan test are put forward. Based on the above knowledge, the generation of test vectors and analysis method of the response belonged to the boundary-scan method are introduced in the following. At last, the testability design based on boundary-scan belonged to a complex electronic component is presented.

Zhanyong Ren Dandan Liu Zhaoyang Zeng

China Avic Aero-polytechnology Establishment Beijing 100028, China

国际会议

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

西安

英文

1088-1092

2010-08-16(万方平台首次上网日期,不代表论文的发表时间)