会议专题

Design for Reliability - A Reliability Engineering Framework

More and more, reliability is seen as a key differentiator in an extremely competitive globalized market. Recent examples from the automotive sector illustrate very well how serious the impact from field problems can be, more in particular when safety risks are possibly involved: liability claims, recall actions, negative effect on the market share of a brand and so on. But how to match the growing pressure to shorten the product development cycle with reliability targets as no early failures in the field during the warranty period, a low intrinsic failure rate during the useful life of e.g. 10 years and wear out only beyond the useful life of the product? To deal with this, a Reliability Engineering Framework is described consisting of 3 layers: a process layer, a tools layer and a managerial layer. This framework allows mitigating potential reliability risks at early phases of the product development so that the development time can be decreased considerably.

J.F.J.M.Caers X.J.Zhao J.Mooren L.Stulens E.Eggink

Philips Applied Technologies Eindhoven, The Netherlands

国际会议

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

西安

英文

1108-1113

2010-08-16(万方平台首次上网日期,不代表论文的发表时间)