Thermal Stress Analysis and Optimization for a Power Controller SiP Module
In this paper, the finite element analysis method is used to investigate the thermal-mechanical behaviors of a power controller SiP module under power load. The effects of die attach (DA) material and epoxy molding compound (EMC) on the maximum temperature and maximum stress in the die are investigated. The packaging materials and geometry parameters of the module are optimized according to the simulation results. The results illustrate that the maximum temperature of die decreases with increase in EMC thickness or DA material thickness. The maximum stress is located at the corner of die, and the thickness of DA material and the CTE of EMC have different influence on the thermalmechanical stress induced in the die. After optimizing, the maximum temperature could decrease about 3.437 K, and the maximum equivalent stress and shear stress could decrease by 25.7％ and 33.4％, respectively.
Li Zhibo Chu Huabin Chen Supeng Li Guoyuan
School of Electronic and Information Engineering, South China University of Technology, Guangzhou 51 Guangdong Yuejing High Technology Co. Ltd., Guangzhou 510663, China School of Electronic and Information Engineering, South China University of Technology, Guangzhou 51
国际会议
西安
英文
1114-1117
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）