Experimental Study on the Effect of Reflow Soldering Temperature Profile on the Solder Joint Shape
In this paper, Surface mount experiment of Sn-Pb and Lead Free solder joints under different thermal reflow profile was aimed at statistical analysis of the reflowed cross-section contour and shape parameters (height, diameter and contact angle). The results as follows: Reflowed solder joints was a potshaped body which the top pad is slightly smaller than the bottom pad, and the maximum diameter of solder joints in the side was under the central position; Solder joint shapes obtained from different thermal reflow profiles have greatly differences; The smaller heating factors, the higher height and the smaller diameter and contact angle of solder joint formed by welding.
Bo Wang Xuexia Yang Yu Zhang Xuefeng Shu
Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West School of Mechanical Engineer and Automation, Northeastern University Shenyang 110004, China
国际会议
西安
英文
1128-1131
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）