Research on Reliability of Board Level Package-on-Package in Drop Test
Packaging components are key parts for portable electronics, such as notebooks, cameras and cell phones. The mechanical shock resulted from mishandling during transportation or customer usage may cause solder joint failure of packages, which leads to malfunction of product. Therefore, the reliability performance of solder balls under drop impact loading has become an important topics to researchers and the electronic product manufactures. Here, the study on the stacked package-on-package (POP) is completed in free drop test, according to the condition B in the drop test standard of JEDEC. The dynamic strain responses at some key positions of the Printed Circuit Board (PCB) are recorded by strain gages to study the board level response under impact, and the behavior of dynamic resistance of POP components is well understood. These researches will provide a feedback link to the performance of the PCB with POP packages in accidental drop.
Yao Xiaohu Fan Zerui Yuan Miaomiao Zhang Xiaoqing Li Zhiqiang Han Qiang
School of civil engineering and transportation, South China University of Technology, Guangzhou 510640, P. R. China
国际会议
西安
英文
1138-1141
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）