Analysis on the Abilities of Solder Joints to Resist Thermal Fatigue and Service Life Prediction
The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First, ten 2D simplified models of PBGA (Plastic Ball Grid Array package) structure with different shape of solder joints, which are obtained from surface mount experiments, are established using finite element software. Then, the stressstrain response of solder joints is obtained. Finally, according to the modified Coffin-Manson’s empirical formula, the thermal fatigue lives of solder joint above mentioned are predicted. The result shows the fatigue life of lead-free solder joints is as 3.5 times as SP solder joints’.
Xuexia Yang Bo Wang Yu Zhang Xuefeng Shu
Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West School of Mechanical Engineer and Automation, Northeastern University Shenyang 110004, China
国际会议
西安
英文
1147-1150
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）