Fatigue fracture mechanisms of Cu/lead-free solders interfaces
The fatigue fracture behaviors of a series of Cu/lead-free solder joints deformed under different directions of loadings were investigated in this study. Observation results showed that fatigue cracks generally initiate around the IMC/solder interface when the loading axis is vertical to the interface. For all the solder joints, the interfacial deformations are resulting from strain localization induced by the stain mismatch. Fracture surface observations reveal that the crack propagation path and fatigue resistance of the solder joints are affected by the yield strength and mechanical property of the solder. When the copper/solder interface is parallel to the loading axis, the interfacial IMC layer failed approximately perpendicular to the interface under the action of slip bands, and then the cracks propagated to the IMC/solder interface, leading to the fracture along the interface.
Q. K. Zhang Q. S. Zhu Z. F. Zhang
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,72 Wenhua Road, Shenyang, 110016, China
国际会议
西安
英文
1168-1173
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）