Evaluating the Printability of Solder Paste from Paste Roll Characteristics
The printability of the solder paste is critical to product yield in a SMT (Surface Mount Technology) line. Both the material and the process must be controlled to minimize variations in solder paste printability and reduce soldering defects. In this letter we describe a newly developed print tester that measures characteristics of the squeegee/drumstencil interaction to monitor the printability of solder paste. The device includes an optoelectronic monitoring system to detect the paste roll velocity, allows precise adjustment of the printing parameters and imposes a continuous squeezing action on the solder paste. We use the measurements of roll velocity as function of time and distance to propose a new measurement standard, named “print life, which offers a quantitative and cost-effective evaluation of the printability of solder paste.
Bing An Yi-ping Wu
Department of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074,China
国际会议
西安
英文
1186-1189
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）