Welding failure analysis of tungsten-copper composite material used for microwave circuits
Due to have excellent thermal, electrical performance, W-Cu composite materials were wildly used in high-power microwave devices and large-scale integrated circuits as the substrate, embedded blocks, connectors and heat dissipation devices. This paper aiming at the problem of welding failure between a batch of home-made W-Cu composite materials and the Kovar alloy when doing microwave circuit welding. Compared with to the import W-Cu composite materials, scanning electron microscopy (SEM) and electron probe energy dispersive spectroscopy (EDS) were carried out on the microstructure and micro-area composition analysis. The poor welding causes of the materials were found. Through improved technology, increase the Cu content in the Cu-W composite material, and its weld ability with Kovar alloy was enhanced.
Ye Jianhai Bao Shengxiang Ma Lili Shi Guanghua Li Peng
State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China, Chengdu 610054, China
国际会议
西安
英文
1195-1200
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）