Investigation of package warpage effect on TC solder joint reliability
Thermal fatigue of solder joints is critical to electronic package performance and life consideration. Failure caused by device warpage (WPG) problems is a major challenge with demands for miniaturization and system integration in a faster, better, and cheaper environment. This paper discusses a relationship between warpage and thermal fatigue life time and failure mechanism under thermal cycling (TC), especially for samples with large warpage. A laser-based surface profiling technique was used to characterize the package warpage. Device warpage is a function of temperature, and it is tested by shadow moiré. Elastic-plastic-creep constitutive model was built to confirm critical stress location during TC, and in-plane moiré was used for correlating the simulation model. Experiment results reveal that component warpage change has an important effect on TC lifetime.
Jianhui Wang Long Wen Jianwei Zhou Jaisung Lee
Samsung Semiconductor (China) R&DNo.15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China 215021 Samsung Semiconductor (China) R&D No.15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China 21502
国际会议
西安
英文
1201-1205
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）