Effects of Solder Joint Shape on Joint Reliability under Drop Impact Loadings
The purpose of this paper is to compare the ability of solder joint with different shape (hourglass-shaped, barrelshaped and cylinder-shaped) to resist destruction under drop impact loadings. Three 3D finite element models of VFBGA (very-thin-profile fine-pitch BGA) packages, including different shape of solder joints, are established respectively. According to the condition B in the drop test standard of JEDEC, the stress-strain responses of the whole packages under drop impact loadings are calculated by ANAYA/LSDYNA. The results showed that the stress on the solder joint reaches its peak at about 1ms and the maximum peeling stress on the critical solder joint which is located at the most outer corner of the BGA package. The hourglass-shaped solder joints which show the minimum peeling stress at the critical moment, have the strongest ability to resist destruction among three shaped solder joints under drop impact loadings.
Xuexia Yang Zhigang Li Guozheng Yuan Xuefeng Shu
Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West Yingze Street, Taiyuan, 030024, Shanxi, China
国际会议
西安
英文
1206-1209
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）