The Effect of Drilling Parameters on the Wicking in High Density PCB Processing

摘要：

Wicking is one of the important factors that cause the internal short of Printed Circuit Board (PCB), and directly restrict the pitch of holes. In this paper, orthogonal experimental design method is used to study the effect of five drilling parameters on the wicking. The five factors are rotation speed, feeding speed, retracting speed, drill life and stack number. The result shows that the order of the influencing factors is as follows: stack number, drill life, rotation speed, retracting speed, feeding speed. It is found that the optimum parameters combination is rotation speed of 150 kr/min, feeding speed of 38 mm/sec, retracting speed of 280 mm/sec, drill life of 1600 hits and stack number of 1 PNL/stack.

作者: Liquan Wang Fengshun Wu Longzao Zhou Dong Liu Tuanfen Gaoc Xuefei Jiang

作者单位: State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Scie Shenzhen Suntak multilayer circuit board Co., LTD, Shenzhen, China, 518054

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1214-1217

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）