Advanced Deformation Measurements for electronic products at manufacturing & operating temperatures

摘要：

Deformation Measurements under thermo-mechanical load are quick and useful tool to increase the reliability of electronic products and to verify Finite Element Models (FEM). Two Examples demonstrate the advanced use.

作者: Bernd Schwarz Siemens AG

作者单位: Dep. CT T DE HW 5,Siemensdamm 50, 13629 Berlin, Germany

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1242-1245

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）