Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

摘要：

Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller. The results of the simulations and experiments indicate that the underfill process technology is highly effective means to improve the mechanical strength of miniaturized thermoelectric coolers.

作者: Xingrui Chen Teng Wang Joachim Nurnus Mike Benkendorf Johan Liu

作者单位: SMIT Center and Department of Microtechnology and Nanoscience, Chalmers University of Technology, Se Micropelt GmbH, Germany Emmy-Noether-Str.2, 79110 Freiburg, Germany SMIT Center and Department of Microtechnology and Nanoscience, Chalmers University of Technology, Se

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1250-1254

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）