Burn-in Screening Technology of Power Bare Die

摘要：

his paper focuses on the Burn-in Screening Technology of Power Bare Die. A temporary carrier that allows the power bare die full temperature testing and burn-in has been described. A suitable improvement multi-bump contact carrier technology has been put forward and Experiment results have shown that the contact resistance of the new carrier decrease 40％ significantly. Base on the peak value junction temperature controlling, A more effective power bare die pulse full power burn-in screening technology have been proposed, which power bare dies would be burn-in screened by 100％. So the high quality and reliability requirements for bare power die of MCM and SiP are met.

作者: Huang Yun Yang Shaohua En Yunfei Feng Yongjie

作者单位: National Key Laboratory of Science and Technology on Reliability Physics and Application of Electronic Component China Electronic Produce Reliability and Environmental Testing Research Institute No.110 Dongguanzhuang Rd.,Guangzhou city , P.R.China

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1255-1258

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）