A Verification of Application Specific Component Qualification

摘要：

Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due to surrounding components or the system can decrease individual component reliability. Not accounting for these operating stresses resulting from other components or the system will lead to lower life than anticipated. Using a case study, the authors demonstrate how the fatigue life of a chip component mounted on a PCB is affected by powered components on the board in close proximity.

作者: Vidyu Challa Michael Pecht Shilin Liu Qiang Yu

作者单位: Center for Advanced Life Cycle Engineering (CALCE) University of Maryland, College Park, MD 20742 Department of Mechanical Engineering Yokohama National University

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1265-1268

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）