Nanoindentation characteristics of Cu6Sn5 formed in lead free solder joints
A new structural effect that was developed based on the concepts of the cantilever beams has been proposed in order to illustrate the measurement divergence of nanoindentation test for Cu6Sn5 IMCs. Cu6Sn5 IMCs were fabricated in Sn3.5Ag/Cu solder joints by wetting reaction at 250 ℃ and subsequent thermal aging, and measured by nanoindentation. In this study, the extra displacement created by the cantileverlike beam structural effect were investigated and discussed through the experimental initial and boundary conditions of Cu6Sn5 IMCs. The results showed that the variations of the loading procedures, sample shape, indent positions and indent directions would change the strain gradients on the matrixes, and thus cause the extra displacement. Moreover, through the study of the two-dimensional finite element analysis, the data divergence is minor in the top-view direction. In light of the results obtained from this study, we believe that structural effect would influence measurement accuracy for nanoindentation and test in the top-view direction would have great potential for future applications.
Zhihao Zhang Jongmyung Kim Mingyu Li
State Key Laboratory of Advanced Welding Production Technology, Harbin institute of technology Shenz Jeonnam Provincial College, Jeonnam 517-802, Korea
国际会议
西安
英文
953-956
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）