Piezoresistive Pressure Sensors Based on System in Packaging Technology of MEMS

摘要：

The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a metal shell by SIP technology and special packaging techniques to form a full pressure sensor. Tests have proved that this kind of pressure sensor has good performance. Compared with traditional pressure sensors, these sensors based on SIP have small volume, low cost, and could compatible with the strict standard of vehicle.

作者: Xiong Shi Jian Xu Zhiyin Gan Sheng Liu

作者单位: Electrical and Information Department, Wuhan Polytechnic University;Wuhan, Hubei, China,430023;Divis Division of MOEMS, Wuhan National Laboratory for Optoelectronics;Huazhong University of Science and

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1337-1341

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）