Experimental Research of Micro-channel Cooler
With the continuously decreasing size and constantly increasing integration of IC chips, the heat flux is increasing rapidly. Many enhancements are proposed in order to increase the thermal conductivity of micro-channels including nanofluids, special shapes, and two phase flows, etc. This paper explores a new test system to measure the heat transfer performance of micro-channel cooler. Considering the accuracy of the test, materials with lower thermal conductivity is selected to package the cooler, and a DAQ system is set up to collect the test data. It’s found that in most cases laminar flow occur, and some relationships between temperature, pressure, heat flux and mass flow are obtained. And this research proceeds as foundation for the further research work.
Li Zongshuo Wang Xiaojing Wang Dianxiao Wang Jia
Shanghai University, 224mail box, 149 Yan Chang RD. Shanghai, 20072, China
国际会议
西安
英文
1355-1358
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）