Study of MEMS Self-Assembly Using Molten Solder Ball
MEMS solder self-assembly technique can assemble the quasi-three-dimensional microstructures to the final threedimensional devices using the surface tension of the molten solder. A model based on the minimum surface energy principle has been developed. Experimental studies are conducted to verify the model. It is shown that the final rotating angle matches well with the predicted angle, and the error is less than ±3o. By analyzing the impact of factors on the solder self-assembly process, the parameter K and the pad aspect ratio P_k were determined as the dominant factors. Finally, the influencing regularities of the dominant factors affecting the equilibrium angles are obtained with further studies.
Lei Yang Chunqing Wang Wei Liu Yang Li
State Key Lab of Advanced Welding Production Technology, School of Materials and Engineering Harbin The 13th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, 050051,
国际会议
西安
英文
1302-1307
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）