Metal Surface Cleanliness and Its Improvement on Bonding

摘要：

The cleanliness of Au, Cu and Sn surfaces by Ar fast atom beam (FAB) and Ar-plasma treatment was investigated using X-ray photoelectron spectroscopy (XPS). Oxides and organic residues can be removed and clean metal surfaces can be achieved using Ar-FAB activation. The vacuum background of Ar-plasma pretreatment influenced the cleanliness to metal surfaces. The influence of surface cleanliness was investigated by bonding micro-bumps of Au/Sn and Sn-Ag-Cu micro-bumps at 25-100℃. Au/Sn micro-bumps were successfully bonded t to Au and Cu thin films and Au/Sn micro-bumps at room temperature. Regardless of the vacuum background, Ar RF plasma pretreatment improves the bondability of Au/Sn and Sn-Ag-Cu micro-bumps at low temperatures in ambient air.

作者: Ying-Hui Wang Tadatomo Suga

作者单位: School of Engineering, the University of Tokyo Hongo 7-3-1, Bunkyo-ku, Tokyo 113-8656, Japan

会议类型: 国际会议

会议名称: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

会议地点: 西安

会议语种:英文

页码: 1317-1320

在线出版日期: 2010-08-16（万方平台首次上网日期，不代表论文的发表时间）