Study on Adhesive Reliability of Low-Temperature Sintered High Power LED Modules
Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will occur due to thermal expansion coefficient mismatch of chip and substrate. Therefore, it is necessary to study the reliability and failure mechanism of low temperature sintered nano-silver joint. In this study, loading-control shear fatigue tests, temperature cycling and hygrothermal aging tests were conducted on sintered nano-silver paste connected LED modules, through which we made an initial exploration on the mechanical reliability and failure mechanism of this new type of interconnection material.
Xin Li Xu Chen Dun-Ji Yu Guo-Quan Lu
School of Material Science and Engineering, Tianjin University, Tianjin, P.R. China;4Tianjin Key Lab School of Chemical Engineering and Technology, Tianjin University, Tianjin, P.R. China; School of Ch School of Chemical Engineering and Technology, Tianjin University, Tianjin, P.R. China Deptartment of Material Science and Engineering, Virginia Tech, USA;School of Material Science and E
国际会议
西安
英文
1371-1376
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）