Integration of Phosphor Printing and Encapsulant Dispensing Processes for Wafer Level LED Array Packaging
Phosphor converted LEDs (pc-LEDs), which employ blue LEDs with yellow phosphor deposition to generate white light illumination is a widely used solid-state lighting source. This paper presents the integration of two major processes, namely, phosphor screen printing and moldless encapsulant dispensing, for wafer level pc-LED packaging. In the present study, the processing procedures and parameters of phosphor screen printing were developed and investigated in detail. The attributes of the phosphor layer by screen printing such as packing density, thickness, uniformity and adhesive strength, which control the performance of final white light illumination, were characterized. Subsequently a moldless encapsulant dispensing process was applied at the wafer level. Optical performance of the packaged LEDs was evaluated. The prototype of 5x5 white light LED arrays demonstrated that a wafer level LED packaging can be achieved with the integration of the two novel processes.
Kewei Chen Rong Zhang S. W. Ricky Lee
Electronic Packaging Laboratory Center for Advanced Microsystems Packaging Department of Mechanical Engineering Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong, China
国际会议
西安
英文
1386-1392
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）