Enhancement of Light Extraction of Multi-Chips Light-Emitting Diode (LED) Modules with Various Micro-structure Arrays
Low light extraction efficiency (LEE) is one of the most challenging points for light-emitting diode (LED) array packaging. Analysis of LEE enhancement of LED array packaging with micro-structures on packaging silicone is presented. To obtain high LEE, micro-structures including inversed cone, inversed frustum of a pyramid (FP) and Vgroove are introduced. Two types of LED chips consisting of conventional chip (CC) and vertical thin film chip (VTFC) are conducted. Monte Carlo ray tracing simulation results demonstrate that micro-structures are able to effectively improve the LEE of LED array packaging. Among the three structures the inversed FP structures are shown to be the most efficacious in improving the LEE with enhancement of 43.18％ and 31.07％ for CC and VTFC respectively. This method would be a potential way in improving the LEE of LED array packaging with low profile.
Dan Wu Kai Wang Xiaobing Luo Sheng Liu
Division of MOEMS,Wuhan National Laboratory for Optoelectronics, School of Optoelectronics Science & School of Energy & Power Engineering, Huazhong University of Science & Technology, Wuhan 430074, Chi Division of MOEMS,Wuhan National Laboratory for Optoelectronics, School of Optoelectronics Science &
国际会议
西安
英文
1398-1400
2010-08-16（万方平台首次上网日期，不代表论文的发表时间）