Impact on PC light guide plate warpage caused by injection parameters

摘要：

By the way of orthogonal test and keeps the Warpage as the study object, the paper studies different molding technological parameters which have different levels of impacts on light guide plate with diversity thickness. Moreover, numerical simulation is used, trying to discuss that technical parameters have influences on the light guide plate. The paper also points out that there may exists huge differences between technical conditions with light guide plates which hold diversity thickness. It aims at providing the basis of choosing the best technical companies, in order to give a further study on accuracy and optical quality of light guide plate.

关键词： Light guide plate injection parameters Warpage orthogonal test

作者: Yin Sufeng Wang Jianyu Ruan Feng

作者单位: South China University of Technology,Guangzhou,Guangdong, 523992 China Dongguan University of Techno Dongguan Yidong electronic co., Ltd. Dongguan, Guangdong, 523106, China South China University of Technology,Guangzhou,Guangdong, 523992 China

会议类型: 国际会议

会议名称: 2010 International Conference on Digital Manufacturing and Automation(2010 数字制造与自动化国际会议 ICDMA 2010)

会议地点: 长沙

会议语种:英文

页码: 822-828

在线出版日期: 2010-12-18（万方平台首次上网日期，不代表论文的发表时间）