The cause analysis model of pseudo solder for chip component

摘要：

A cause analysis model of pseudo solder for chip component is presented. Based on analyzing the causes of the chip pseudo solder, an comprehensive equation, which is composed of an ellipse equation and a circle equation, is used to fit the surface shape of chip solder joint On the basis of that, the chip pseudo solder model is presented. All the parameters of the chip pseudo solder model are effected by the surface mounted technology process, such as solder paste printing process, mounting processing, reflowing process and so on. Experiments results show that the surface shape of the chip solder joint is fit effectively by the comprehensive equation. Experiments results also show that parameters of the chip pseudo solder model can illustrate the cause of pseudo solder effectively.

关键词： pseudo solder solder joint PCB pseudo solder model surface mounted technology

作者: Fupei Wu Shengping Li Yongjie Zhao

作者单位: Department of Mechatronic Engineering, Shantou University, Shantou, 515063, China Shantou Institute for Light Industrial Equipment Research, Shantou, 515063, China

会议类型: 国际会议

会议名称: 2010 International Conference on Digital Manufacturing and Automation(2010 数字制造与自动化国际会议 ICDMA 2010)

会议地点: 长沙

会议语种:英文

页码: 636-638

在线出版日期: 2010-12-18（万方平台首次上网日期，不代表论文的发表时间）