The research on the temperature control device for the zipper-molding mechanism

摘要：

According to the theory of thermal conductivity, this paper analyzes its reason contrapose this phenomenon the nylon lack of tenacity happens to crack when in the molding process. Meanwhile, this paper takes advantage of the soft ANSYS to analyze the center temperature distribution of the back mould in the molding process. The thermo-module which prevents this phenomenon from coming up, is redesigned to heat the nylon linear material plastic making in the molding screw. This module will decrease scrappage of zippers numerously.

关键词： thermal conductivity nylon zippers the molding mechanism

作者: Zeng Lingjun

作者单位: Machinery and Power-generating Department, Xiamen University, Xiamen, Fujian, 361005, China

会议类型: 国际会议

会议名称: 2010 International Conference on Digital Manufacturing and Automation(2010 数字制造与自动化国际会议 ICDMA 2010)

会议地点: 长沙

会议语种:英文

页码: 796-799

在线出版日期: 2010-12-18（万方平台首次上网日期，不代表论文的发表时间）