THE APPLICATION OF BORIC ACID MODIFIED PHENOLIC RESIN USED IN ALUMINO-SILICATE FIBER PAPER

摘要：

Ordinary phenolic resin used as alumino-silicate fiber paper’s adhesive can’t resist the high temperature but the paper was usually used in high temperature condition. In order to improve the temperature stability of phenolic resin, it was modified with boric acid, making the phenolic resin to be a temperature resistant structural adhesive, and after it was modified, the phenolic resin’s softening point can raise from 180 ℃ to 600 .B ℃ esides, alumino-silicate fiber paper which uses boric acid modified phenolic resin as adhesive, can still keep high intensity.

关键词： alumino silicate fiber boric acid modified phenolic resin temperature resistant structural adhesive high intensity

作者: Zhao Chuanshan Wang Jingjing Pang Jinjiang Zhu Qing Xing Qianqian

作者单位: Key Laboratory of Paper Science and Technology of Ministry of Education Shandong Institute of Light Industry, Jinan, 250353, China

会议类型: 国际会议

会议名称: 4th ISETPP(第四届制浆造纸新技术国际研讨会)

会议地点: 广州

会议语种:英文

页码: 1562-1565

在线出版日期: 2010-11-08（万方平台首次上网日期，不代表论文的发表时间）