Thermoelectric Properties of Silicon MicroChannel Plates Structures
We have fabricated silicon microchannel plates (MCPs) by photo-assisted electrochemical etching (PAECE) and determined the thermoelectric properties by measuring the Seebeck coefficient of the samples. The samples are composed of regular arrayed lattices with a width of about 5 urn and spacing of about 1 urn. The Seebeck coefficient along the edge of the lattice is 466 μV/K. The silicon MCPs are potential materials for power generation and refrigeration. After oxidation from 30 minutes to 70 minutes and removing the silicon dioxide layer by buffered hydrofluoric acid, the samples show an improved coefficient as high as 1019 μVTK after repeating oxidation and etching 5 times. Our results show that me Seebeck coefficient increases when the wall of the silicon MCPs is thinned.
P L Ci J Shi F Wang L Sun S H Xu P X Yang L W Wang Paul K Chu
Laboratory of Polar Materials and Devices, Ministry of Education, and Department of Electronic Engin Department of Physics and Material Sciences, City University of Hong Kong, Tat Chee Avenue, Kowloon,
国际会议
3rd International Photonics & OptoElectronics Meetings(第三届国际光子与光电子学会议 POEM 2010)
武汉
英文
1-8
2010-11-03（万方平台首次上网日期，不代表论文的发表时间）