Investigation of formaldehyde-free soybean meal-based adhesive applying on particleboard
For manufacturing high mechanical properties and environmental-friendly particleboard,a formaldehyde-free soybean meal (SM)-based adhesive was developed and applied in the mechanical manufacture of particleboard.The thermal behavior of the adhesive was investigated and the properties of the particleboard were tested according to Chinese Standards methods.The results show that the optimum technical parameters were: hot-pressing temperature was 180 ℃,hot-pressing time was 65 s/mm,moisture content was 12 ％,and glue content was 15 ％.The MOR and IB of particleboard were 20.6 MPa and 0.59 MPa respectively.It fully fits the Chinese National Standards GBT 4897.5-2003.Therefore,it is a practical way for manufacturing environmental friendly particleboard by SM-based adhesive.
soy particleboard MOR IB thermal behavior.
Gao Qiang Dong Yaohui Zhang Shifeng Li Jianzhang
College of Wood Sciences and Technology,Key Laboratory of The Ministry of Education of Wood Science and Engineering,Beijing Forestry University,Beijing 100083,P.R.China
国际会议
哈尔滨
英文
2085-2089
2010-07-24（万方平台首次上网日期，不代表论文的发表时间）