Solder Ball Height Measurement by Projection Method

摘要：

The height uniformity of solder ball is an important aspect of solder joint reliability for BGA package. A novel optical method for solder ball height inspection was proposed. A parallel beam was used to illuminate the solder ball, and the shadow of ball was used to measure its height. A machine vision system has been designed to realize this method. Solder ball image and shadow image are obtained by two time lightning and photograph. Digital image process algorithms are developed to evaluate the center and radius of solder balls from the solder ball image, and the projection length from the shadow image. With those information form images, the height of a solder ball and coplanarity is calculated. The experimental results obtained from this new method show good agreement with that obtained by SEM and Veeco.

关键词： ball grid array optical shadow height measurement machine vision image processing.

作者: Qin Jingwen Chen Yun Wang Fuliang

作者单位: State Key Laboratory of High Performance and Complex Manufacturing College of Mechanical and Electrical Engineering,Central South University Changsha 410083,China

会议类型: 国际会议

会议名称: 2011 10th International Conference on Electronic Measurement & Instruments(第十届电子测量与仪器国际会议 ICEMI2011)

会议地点: 成都

会议语种:英文

页码: 1201-1206

在线出版日期: 2011-08-16（万方平台首次上网日期，不代表论文的发表时间）