Electrical Method on Evaluation of Power Device Chips Welding Quality

摘要：

Power devices are widely used in household appliances and industrial products even in the space industry. Because of defects in the package, their electrical parameters might change. Some of them may even lead to irreparable damage on devices. This paper presents a new method for evaluation of the device chips welding quality, by means of analyzing thermal resistance and structure function of the power devices.

关键词： thermal resistance structure function solder layer

作者: Shuojie She Darshan Gandhi Guangbo Gao Mahmood Choudhry Yueqiang Huang Changzhi Lv

作者单位: Reliability Physics Lab Beijing University of Technology Beijing, China International Rectifier Temecula, USA International RectifierTemecula, USA

会议类型: 国际会议

会议名称: 2011 9th International Conference on Reliability,Maintainability and Safety(第九届国际可靠性、维修性、安全性会议 ICRMS2011)

会议地点: 贵阳

会议语种:英文

页码: 99-102

在线出版日期: 2011-06-12（万方平台首次上网日期，不代表论文的发表时间）