Temperature-Humidity Oriented Reliability Prediction for Electronic Equipments
This paper presents a practical method of reliability prediction for electronic devices with operating temperature and relative humidity that will not always be in steady state. Since operating temperature (Tu) and relative humidity (RHU) are various in different regions, the authors use temperature probability distribution function f(Tu) to indicate the change of Tu, and humidity probability distribution function g(RHu) is used to indicate the variation of RHU. In order to estimate equipment reliability for the entire area of product usage, this paper uses these two functions to modify prediction model. The proposed method offers a way to predict the average value of failure rate for the entire area of product usage with accelerated test data and climate information.
electronic devices reliability prediction operating temperature relative humidity accelerated test
Xiaoxue Ding Yufeng Sun Weiwei Hu Bangyan Qi
College of Reliability and System Engineering Beihang University Beijing, China
国际会议
贵阳
英文
149-153
2011-06-12（万方平台首次上网日期，不代表论文的发表时间）