Thermal Management of Integrated Circuits in Burn-in Environment
Burn-in screening test technology has been an important method to ensure integrated circuits(IC) quality and reliability. But there are many problems remains to be solved during burn-in and accurate junction temperature of IC during burn-in is one of these problems. Leakage currents are rapidly increasing with CMOS IC technology scaling, and this will lead to high junction temperature of IC in burnin environment. Positive feedback between junction temperature and leakage currents result in continual junction temperature increases, and thermal runaway will probably happen. In addition, differences of frequency during burn-in and variation of device parameters, all these lead to the junction temperature of IC not the same even in the same burnin environment To solve these problems, a closed-loop temperature controlled system and corresponding integrated ICs case temperature acquired method are presented in this paper. Under the ambient temperature of burn-in oven, each socket is a microenvironment managed by closed-loop temperature controlled system. Several small thermal resistors which measure the temperature of different areas of the IC are mounted on the surface of the IC in the burn-in socket and we choose measured maximum temperature as the feedback signal of the temperature controlled system. Compared with junction temperature of IC without temperature controlled system, junction temperature of different IC with temperature controlled system in burn-in environment almost the same, and steady state error is in the range of 0.2℃ which is far less than differences of junction temperature without temperature controlled system. Rise time and dynamic response time are all much faster. All these advantages make burn-in process reliable and integrated circuits of great reliability.
Integrated circuit burn-in junction temperature temperature controlled system
Bing Bai Shaobo Chen Weiming Wang Hongwei Hao Luming Li
School of Aerospace, Tsinghua University Beijing, China
国际会议
贵阳
英文
1092-1095
2011-06-12（万方平台首次上网日期，不代表论文的发表时间）