Molding Compounds Characteristics Testing of Plastic Device Used in High Reliability Fields

摘要：

In recent years, with the plastic device materials and process progresses, the plastic device reliability has been improved. In this paper, the relationship between the characteristics of molding compounds and device reliability has been researched.

关键词： molding compound ion content moisture absorption reliability

作者: Li Gao

作者单位: China Electronics Standardization Institute Beijing, China

会议类型: 国际会议

会议名称: 2011 9th International Conference on Reliability,Maintainability and Safety(第九届国际可靠性、维修性、安全性会议 ICRMS2011)

会议地点: 贵阳

会议语种:英文

页码: 1189-1192

在线出版日期: 2011-06-12（万方平台首次上网日期，不代表论文的发表时间）