Application of Regression Analysis to Wafer Probe Mark Inspection
This paper presents an image processing approach for identifying six features of the probe mark on semiconductor wafer pads. Then, the proposed approach uses statistical regression analysis to predict the shear strength of the ball bond on the pad based on these six features. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark results in poor adhesion between the bond ball and the pad, leading to undesirable products. The adhesion is measured in terms of shear strength. This paper proposes an automatic vision inspection system capable of predicting the shear strength of the bond ball. If the predicted shear strength is higher than the required value in the industrial standard, the wafer pad can proceed to the next stage of wire bonding. If not, the wafer is discarded.
image process regression analysis probing marks wire bonding
Chau-Shing Wang
Department of Electrical Engineering, Changhua University of Education, Taiwan, China
国际会议
The Institute Industrial Engineera Asian Conference 2011(2011年国际工业工程师协会亚洲会议)
上海
英文
352-358
2011-06-10（万方平台首次上网日期，不代表论文的发表时间）